Vizinex RFID recently added two new pieces of production equipment to its Bethlehem, Pennsylvania, facility. The new equipment supports Vizinex’s growth due to demand for RFID tags, and streamlines the company’s operations. Vizinex doubled its production capacity with a second flip-chip bonder line. It recently in-stalled a Datacon Flip-Chip Die Bonder, which doubles Vizinex’s capacity for RFID tag manufacturing. Vizinex also invested in a Schunk Intec router/saw for cutting ...